一、 Wang-Resin  王樹脂

Wang resin is the most widely used resin for SPOS. As a standard support it can be used for the solid phase immobilization of acids and phenols for SPOS. The ester linkage may be achieved, which has good stability to a variety of reaction conditions, but can be readily removed with the moderate acid treatment, generally with TFA, For the immobilization of amines, Wang resin also can be readily converted into solid phase equivalents of standard urethine-based protecting groups by reaction with phosgene or activated carbonates, such as carbonyl diimidaiole or bis(p-nitrophenyl)-carbonate.

在多肽的合成中，與Wang Resin相連接的氨基酸，通常除去Pro、His、Cys。切割后，C端為羧基形式。

A extremely acid-labile resin for preparing peptides and partially protected peptide fragments by the Fmoc strategy. This resin is ideal for use in the preparation of peptides containing C-terminal Cys, His, Met, Tyr and Pro residues. Cleavage for protected peptides from this matrix can be effected by treatment with AcOH/TFE/DCM,0.5% TFA or HFIP. Fully deprotected peptides can also be obtained by cleaving with 95% TFA in the usual manner.

常用名有：2-CTC Resin、二氯樹脂。
特點：此樹脂對酸非常敏感，通常0.5%TFA就可以將氨基酸從樹脂上脫落。
用途：基本上所有的氨基酸都可以連接到二氯樹脂上，通常C端為Cys、Pro、His時都會選擇使用二氯樹脂，切割后，C端為羧基形式。

三、Aminomethyl resin, AM resin, AM樹脂

The Aminomethyl resin is one of the most widely used functionalized supports for solid-phase synthesis. Many supports can be made by acylating this resin with carboxylic acid-containing linkers using standard methods of amide bond formation to furnish supports for SPOS. It is also used as a scavenger resin in solution phase synthesis to remove excess acids, alkylating agents and other electrophiles.

一種常見的實現(xiàn)C端酰胺化的功能載體，在C端第一個氨基酸和AM樹脂之間，需要加入一種含羧基的交聯(lián)劑，如Fmoc-Linker-OH （CAS：145069-56-3），以實現(xiàn)C端酰胺化。

Fmoc-Linker-AM Resin也叫做Rink Amide-AM Resin 

其結構如下

四、4-methylbenzhydrylamine Resin, MBHA resin 

4-methylbenzhydrylamine Hydrochloride Salt Resin (MBHA resin)

MBHA resin is used in the synthesis of peptide amide by Boc chemistry. This support is more acid sensitive than BHA resin, and thus allow release of the product to be effected with HF or TFMSA under less drastic conditions.

也是一種常見的實現(xiàn)C端酰胺化的功能載體。在C端第一個氨基酸和MBHA樹脂之間，需要加入一種含羧基的交聯(lián)劑，如Fmoc-Linker-OH （CAS：145069-56-3），以實現(xiàn)C端酰胺化。

Fmoc-Linker-MBHA Resin也叫做Rink Amide-MBHA Resin

其結構如下：